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Published at December 3

3D Modular Microrobots: Micro-Origami Cubes with Integrated Si Chips Dive, Communicate, Flash Programs, and Form Collectives

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Released Date: December 3, 2024

Authors: Yeji Lee1, Vineeth K. Bandari1, John S. McCaskill2, Pranathi Adluri1, Daniil Karnaushenko1, Dmitriy D. Karnaushenko1, Oliver G. Schmidt1

Aff.: 1Chemnitz University of Technology, Germany; 2European Centre for Living Technology, Italy

Arxiv: http://arxiv.org/pdf/2412.02224v1