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Published at November 19

MORE-Stress: Model Order Reduction based Efficient Numerical Algorithm for Thermal Stress Simulation of TSV Arrays in 2.5D/3D IC

cs.CE

Released Date: November 19, 2024

Authors: Tianxiang Zhu1, Qipan Wang2, Yibo Lin3, Runsheng Wang3, Ru Huang3

Aff.: 1School of Integrated Circuits, Peking University; 2School of Integrated Circuits, Peking University; Academy for Advanced Interdisciplinary Studies, Peking University; 3School of Integrated Circuits, Peking University; Institute of Electronic Design Automation, Peking University; Beijing Advanced Innovation Center for Integrated Circuits

Arxiv: http://arxiv.org/abs/2411.12690v1